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| FPF1103 / FPF1104 -- Advance Load Management Switch November 2009 FPF1103 / FPF1104 Advance Load Management Switch Features 1.2V to 4V Input Voltage Operating Range Typical RDS(ON): - 35m at VIN=3.3V 55m at VIN=1.8V 85m at VIN=1.2V Description The FPF1103/04 are low RDS P-channel MOSFET load switches of the IntelliMAXTM family. Integrated slew-rate control prevents inrush current from glitch supply rails with capacitive loads common in power applications. The input voltage range operates from 1.2V to 4V to fulfill today's lowest ultra-portable device supply requirements. Switch control is by a logic input (ON-pin) capable of interfacing directly with low-voltage CMOS control signals and GPIOs in embedded processors. Slew Rate Control with tR: 65s Output Discharge Function on FPF1104 Low <1A Quiescent Current at VON=VIN ESD Protected: Above 4000V HBM, 2000V CDM GPIO/CMOS-Compatible Enable Circuitry Applications Mobile Devices and Smart Phones Portable Media Devices Digital Cameras Advanced Notebook, UMPC, MID Portable Medical Devices GPS and Navigation Equipment Ordering Information Part Number FPF1103 FPF1104 Switch Input Output ON Pin Part (Typical) Buffer Discharge Activity Marking At 1.8VIN Q9 QA 55m 55m CMOS CMOS NA 65 Active HIGH Active HIGH tR 65s 65s Eco Status Green Green Package 4-Ball, Wafer-Level ChipScale Package (WLCSP), 1.0 x 1.0mm, 0.5mm Pitch For Fairchild's definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html. (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com FPF1103 / FPF1104 -- Advance Load Management Switch Application Diagram VIN CIN OFF ON ON VOUT FPF1103/FPF1104 GND COUT To Load Figure 1. Typical Application Notes: 1. CIN=1F, X5R, 0603, for example Murata GRM185R60J105KE26 2. COUT=1F, X5R, 0805, for example Murata GRM216R61A105KA01 Block Diagram FPF1103/4 Figure 2. Block Diagram (Output Discharge for FPF1104 Only) (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 2 FPF1103 / FPF1104 -- Advance Load Management Switch Pin Configurations Figure 3. 1 x 1mm WLCSP Bumps Facing Down Figure 4. 1 x 1mm WLCSP Bumps Facing Up VOUT GND A1 A2 VIN ON VIN ON A2 A1 VOUT GND B2 B1 B1 B2 Figure 5. Pin Assignments (Top View) Figure 6. Pin Assignments (Bottom View) Pin Definitions Pin # A1 A2 B1 B2 Name VOUT VIN GND ON Description Switch Output Supply Input: Input to the Power Switch Ground ON/OFF Control, Active High (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 3 FPF1103 / FPF1104 -- Advance Load Management Switch Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VIN ISW PD TSTG TA JA VIN, VOUT, VON to GND Parameter Maximum Continuous Switch Current Power Dissipation at TA=25C Storage Junction Temperature Operating Temperature Range Thermal Resistance, Junction-to-Ambient 1S2P with 1 Thermal Via 1S2P without Thermal Via Human Body Model, JESD22-A114 Charged Device Model, JESD22-C101 Min. -0.3 Max. 4.2 1.2 1.0 Unit V A W C C C/W -65 -40 +150 +85 95 187 4 kV 2 ESD Electrostatic Discharge Capability Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to Absolute Maximum Ratings. Symbol VIN TA Supply Voltage Parameter Ambient Operating Temperature Min. 1.2 -40 Max. 4.0 +85 Unit V C (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 4 FPF1103 / FPF1104 -- Advance Load Management Switch Electrical Characteristics Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85C; typical values are at VIN=3.3V and TA=25C. Symbol Basic Operation VIN IQ(OFF) ISD(OFF) IQ Parameter Supply Voltage Off Supply Current Off Switch Current Quiescent Current Conditions Min. 1.2 Typ. Max. 4.0 1 1 1 3 Units V A A A VON=GND, VOUT=Open, VIN=4V VON=GND, VOUT=GND IOUT=0mA, VON=VIN IOUT=0mA, VON < VIN VIN=3.3V, IOUT=200mA, TA=25C VIN=1.8V, IOUT=200mA, TA=25C 35 55 70 85 65 65 1.1 50 70 m 150 100 110 V 0.35 V A s s s 50 55 105 2.5 s s s s s s s s s 2.5 s s s s s s 1 RON On-Resistance VIN=1.5V, IOUT=200mA, TA=25C VIN=1.2V, IOUT=200mA, TA=25C VIN=1.8V, IOUT=200mA, TA=85C (3) RPD VIH VIL ION tDON tR tON tDON tR tON FPF1103 tDOFF tF tOFF tDOFF tF tOFF FPF1104 tDOFF tF tOFF tDOFF tF tOFF (5) Output Discharge RPULL DOWN ON Input Logic High Voltage ON Input Logic Low Voltage ON Input Leakage Turn-On Delay Turn-On Time (4) (4) VIN=3.3V, VON=0V, IFORCE=20mA, TA=25C, FPF1104 VIN=1.2V to 4.0V VIN=1.2V to 4.0V VON=VIN or GND -1 Dynamic Characteristics VOUT Rise Time Turn-On Delay Turn-On Time VIN=3.3V, RL=10, CL=0.1F, TA=25C 35 65 100 30 40 70 2.0 2.2 4.2 7.0 110 117 2.0 1.9 3.9 2.5 10.6 13.1 (4,6) (4) (4) VOUT Rise Time (4,6) VIN=3.3V, RL=500, CL=0.1F, TA=25C Turn-Off Delay VOUT Fall Time Turn-Off (4,7) (4) (4) VIN=3.3V, RL=10, CL=0.1F, TA=25C Turn-Off Delay VOUT Fall Time Turn-Off (4,7) (4) (4) VIN=3.3V, RL=500, CL=0.1F, TA=25C Turn-Off Delay VOUT Fall Time Turn-Off (4,7) (4) (4) VIN=3.3V, RL=10, CL=0.1F, RPD=65, TA=25C Turn-Off Delay VOUT Fall Time Turn-Off (4,7) (4) (4) VIN=3.3V, RL=500, CL=0.1F, RPD=65, TA=25C Notes: 3. This parameter is guaranteed by design and characterization; not production tested. 4. tDON/tDOFF/tR/tF are defined in Figure 7. 5. Output discharge path is enabled during off. (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 5 FPF1103 / FPF1104 -- Advance Load Management Switch Timing Diagram 90% VOUT 10% tR 90% 10% tF 3.3V 50% VON 50% 90% VOUT tDON 10% tDOFF Notes: 6. tON=tR + tDON. 7. tOFF=tF + tDOFF. Figure 7. Timing Diagram (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 6 FPF1103 / FPF1104 -- Advance Load Management Switch Typical Performance Characteristics 0.30 V IN SH UTDOW N C UR REN T ( A ) VON = VOUT = 0V 0.25 0.20 VIN = 4.0V 0.15 VIN = 3.3V 0.10 VIN = 1.2V 0.05 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) SHUTDOWN CURRENT ( A) 0.20 0.25 VON=V OUT=0V 0.15 0.10 85C 0.05 25C -40C 0.00 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V IN SUPPLY VOLTAGE (V) Figure 8. Shutdown Current vs. Temperature Figure 9. Shutdown Current vs. Supply Voltage 0.07 0.10 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) VIN = 3.3V VIN = 1.2V VIN = 4.0V O FF SUPPLY CU RRENT ( A) 0.09 O F F SU P PL Y CU R R EN T ( A ) VON = 0V 0.06 0.05 0.04 0.03 0.02 0.01 0.00 1.0 1.5 2.0 2.5 3.0 -40C 25C VON = 0V 85C 3.5 4.0 SUPPLY VOLTAGE (V) Figure 10. Off Supply Current vs. Temperature (FPF1103, VOUT is floating) 0.050 0.045 SUPPLY CU RRENT ( A) 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0.000 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) VIN = 3.3V VIN = 1.2V VIN = 4.0V VON = VIN Figure 11. Off Supply Current vs. Supply Voltage (FPF1103, VOUT is Floating) 0.40 0.35 SU PPLY CUR REN T ( A) 0.30 0.25 0.20 0.15 0.10 25C 0.05 0.00 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUPPLY VOLTAGE (V) 85C -40C VON = VIN Figure 12. Quiescent Current vs. Temperature (VON=VIN) (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 Figure 13. Quiescent Current vs. Supply Voltage www.fairchildsemi.com 7 FPF1103 / FPF1104 -- Advance Load Management Switch Typical Performance Characteristics 3.00 VON = 0.75 x VIN 2.50 SUPPLY CU RRENT ( A) VIN = 4.0V S U P P LY C U R R E N T (A) 2.50 2.00 2.00 1.50 VIN = 3.3V 1.00 0.50 VIN = 1.2V 0.00 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) +25C 1.50 +85C 1.00 -40C 0.50 0.00 1.0 1.5 2.0 2.5 3.0 S U P P LY V O LTA G E (V ) 3.5 4.0 Figure 14. Quiescent Current vs. Temperature (VON=0.75 x VIN) 120 100 O N R E S IS T A N C E (m ) 80 60 VIN = 3.3V 40 20 0 -40 -15 10 35 60 85 TJ, JUNCTION TEMPERATURE (C) VIN = 4.0V VIN = 1.2V VON = VIN IOUT = 200mA Figure 15. Quiescent Current vs. Supply Voltage at VON=1.2V 300 250 ON R E SISTA N CE (m ) VON = V IN IO U T = 200mA 200 150 100 85C 50 0 1.0 1.5 2.0 -40C 2.5 3.0 3.5 4.0 25C SUP PLY VOLTAGE (V) Figure 16. RON vs. Temperature 1.00 V O N INPUT LO GIC VOL TAG E (V) Figure 17. RON vs. Supply Voltage 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 1.0 1.5 2.0 2.5 3.0 3.5 4.0 SUP PLY VO LTAG E (V) V IL V IH Figure 18. ON-Pin Threshold vs. VIN (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 8 FPF1103 / FPF1104 -- Advance Load Management Switch Typical Performance Characteristics 10 tR 100 t DON 1 O N /O FF D ELAY TIM E (s) R IS E /FA LL TIM E ( s) VIN = 3.3 CL= 0.1 RL= 10 VIN= 3.3 CL= 0.1 F RL= 10 10 tF 1 -15 1 3 6 8 TJ JU N C TIO N TE M P E R A TU R E (C ) t DOFF 1 -40 -15 10 35 60 85 TJ JU N C T IO N T E M P E R A T U R E (C ) Figure 19. VOUT Rise and Fall Time vs. Temperature at RL=10 60 50 R IS E /FA LL TIM E (s) Figure 20. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=10 60 50 O N /O F F D ELAY T IM E (s) tR VIN= 3.3 C L= 0.1 F R L= 50 0 t DON 40 30 20 10 0 -40 -15 10 35 60 85 TJ JU N C TIO N T E M P E R A T U R E (C ) VIN =3.3 C L =0.1 F R =50 0 40 30 20 10 tF t DOFF 0 -40 -50 10 35 60 85 TJ JU N C TIO N TE M P E R A TU R E (C ) Figure 21. VOUT Rise and Fall Time vs. Temperature at RL=500 90 80 Figure 22. VOUT Turn-On and Turn-Off Delay vs. Temperature at RL=500 R ISE /D E L AY T IM E ( s ) 70 60 50 40 30 20 10 0 10 tR t DON R LOA D 10 0 O U T P U T L O AD ( ) 100 0 Figure 23. tR/tDON vs. Output Load at VIN=3.3V (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 9 FPF1103 / FPF1104 -- Advance Load Management Switch Typical Performance Characteristics Figure 24. Turn-On Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=10) Figure 25. Turn-Off Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=10) Figure 26. Turn-On Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=500) Figure 27. Turn-Off Response (VIN=3.3V, CIN=1F, COUT=0.1F, RL=500) (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 10 FPF1103 / FPF1104 -- Advance Load Management Switch Application Information Input Capacitor An IntelliMAX switch doesn't require an input capacitor. To reduce device inrush current effect, a 0.1F ceramic capacitor, CIN, is recommended close to the VIN pin. A higher value of CIN can be used to further reduce the voltage drop experienced as the switch is turned on into a large capacitive load. TM Fall Time Device output fall time can be calculated based on RC constant of the external components as follows: t F = R L x C L x 2 .2 (1) where tF is 90% to 10% fall time, RL is output load, and CL is output capacitor. The same equation works for a device with a pull-down output resistor. RL is replaced by a parallel connected pull-down and an external output resistor combination, as follows: tF = R L x R PD x C L x 2 .2 R L + R PD Output Capacitor An IntelliMAX switch works without an output capacitor. However, if parasitic board inductance forces VOUT below GND when switching off, a 0.1F capacitor, COUT, should be placed between VOUT and GND. TM (2) where tF is 90% to 10% fall time, RL is output load, RPD=65.is output pull-down resistor, and CL is the output capacitor. Resistive Output Load If resistive output load is missing, the IntelliMAX switch without a pull-down output resistor is not discharging the output voltage. Output voltage drop depends, in that case, mainly on external device leaks. TM (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 11 FPF1103 / FPF1104 -- Advance Load Management Switch Recommended Land Pattern and Layout For best thermal performance and minimal inductance and parasitic effects, it is recommended to keep input and output traces short and capacitors as close to the device as possible. Below is a recommended layout for this device to achieve optimum performance. Figure 28. Recommended Land Pattern and Layout (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 12 FPF1103 / FPF1104 -- Advance Load Management Switch Physical Dimensions Figure 29. 4 Ball, 1.0 x 1.0mm Wafer-Level Chip-Scale Packaging (WLCSP) Product-Specific Dimensions Product FPF1103 FPF1104 D 960m 30m 960um 30m E 960m 30m 960um 30m X 0.230mm 0.230mm Y 0.230mm 0.230mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild's worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor's online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 13 FPF1103 / FPF1104 -- Advance Load Management Switch (c) 2009 Fairchild Semiconductor Corporation FPF1103 / FPF1104 * Rev. 1.0.1 www.fairchildsemi.com 14 |
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